Identification method of apparatus to be recalled and heating method

ABSTRACT

A method for identifying apparatuses to be recalled that enables identifying the locations of the products to be recalled, the method including: collecting steps (S 2  and S 4 ) of collecting the information items stored in IC tags from the apparatuses with the IC tag via a communication network, a checking step (S 6 ) of checking the information items collected in the collecting step with the information items related to the apparatuses to be recalled, and an identifying step (S 8 ) of identifying the apparatuses to be recalled in the apparatuses with the IC tag based on the checking results.

TECHNICAL FIELD

The present invention relates to an identification method of apparatusesto be recalled and a heating method, especially to an identificationmethod of apparatuses to be recalled and a heating method in the case ofusing information items stored in each integrated circuit (IC) tag.

BACKGROUND ART

A method for writing, in an IC tag that is set on a printed-circuitboard, information items for identifying components mounted on aprinted-circuit board or a mounter by which the components are mountedhas been proposed conventionally (for example, refer to JapaneseLaid-Open Patent application No. 7-321492 publication). This method ofreading the information items stored in the IC tag enables acquiring themanufacturing control information of the printed-circuit board, thequality information of the components and the like so as to ensure thetraceability.

However, once a printed-circuit board is installed in a product and setat a house or the like, it is practically impossible to trace themanufacturing control information and the like concerning theprinted-circuit board today even in the case where the information itemsfor identifying those components or the mounter is written in the ICtag. Therefore, it is difficult to know, at home, which printed-circuitboard is used for a product.

Therefore, in the case where household electrical appliances that havealready been in the market need to be replaced by new products and somehousehold electrical appliances are to be recalled, there is a problemthat the recall must be notified by newspaper advertisement or the likeonly.

In addition, it is preferable to use the information items written inthe IC tag for the heating control of various objects.

The present invention is conceived in order to solve the above-mentionedproblem, and an object of this invention is to provide convenientmethods where IC tags are used for identifying locations of objects suchas products to be recalled or objects to be heated and controlled. Morespecifically, the primal object is to provide a method for identifyingappliances to be recalled that enables identifying locations of productsto be recalled, and the secondary object is to provide a heating methodthat enables performing heating control on various objects based on theinformation items written in the IC tags.

DISCLOSURE OF INVENTION

In order to achieve the above-mentioned objects, the method foridentifying appliances to be recalled in the present invention includes:collecting information items stored in an integrated circuit (IC) tagattached to an apparatus via a communication network; checking thecollected information items with respectively corresponding informationitems related to the apparatus to be recalled; and identifying theapparatus to be recalled, among apparatuses, to each of which an IC tagis attached, based on a checking result and one of the information itemswhich indicates a sending source stored in the IC tag.

In this method, the information items stored in the IC tag of anappliance is collected and used for checking whether the currentappliance is the appliance to be recalled so as to identify whether thecurrent appliance is the appliance to be recalled. Therefore, unlike theconventional method, it is possible to automatically identify thelocations of the appliances to be recalled without making any recallnotification of appliances by using newspaper advertisement or the like.

Preferably, the above-mentioned method for identifying appliances to berecalled further includes a display step causing the appliance todisplay, on its display unit, the notification that it is the applianceto be recalled in the case where the appliance that is identified as theappliance to be recalled in the above-mentioned identification step hasa display unit.

Causing the appliance to display, on its display unit, the notificationthat it is the appliance to be recalled enables the user to immediatelyknow that the appliance in use is the appliance to be recalled. Thisfacilitates the recall of the appliances.

A heating method in another aspect of the present invention is a heatingmethod for heating an object using different heating ways that are setfor respective areas. An IC tag where heating ways for the respectiveareas are stored is attached to the object, and the heating methodincludes a reading step of reading the heating ways for the respectiveareas from the IC tag and a heating step of heating the object using thedifferent heating ways for the respective areas according to the readheating ways that are set for the respective areas.

A different heating method can be used for heating each object placed oneach area. Therefore, in the case where the object is a printed-circuitboard where components are mounted, it is possible to change thetemperature in a reflow oven according to the heat characteristic of acomponent, which makes it possible to avoid a phreatic explosiontriggered by a heated component. In addition, it is possible to use asolder which includes little lead in the case of a component with a highheat resistance temperature, which has an effect of beingenvironmentally friendly.

Note that the present invention can be realized not only as a methodincluding these steps but also as an apparatus having unitscorresponding to these characteristic steps. Also, the present inventioncan also be realized as a program for causing a computer to executethese steps. In addition, such program can be distributed via arecording medium such as a CD-ROM and the like or a communication mediumsuch as the Internet.

As explained up to this point, the present invention enablesautomatically identifying the locations of the apparatuses to berecalled without making any recall notification of appliances by usingnewspaper advertisement and the like. Therefore, it is possible torealize an efficient recall of the appliances.

Also, a different heating method can be used for heating each objectplaced on each area. Therefore, changing the temperature in a reflowoven according to the heat characteristic of a component makes itpossible to avoid a phreatic explosion triggered by a heated componentmounted on a printed-circuit board or use a solder with little lead on aprinted-circuit board.

Also, the present invention is highly practical because it enablesidentifying the locations of the appliances to be recalled based on theinformation items stored in the IC tags and surely recalling theappliances. Also, a different heating method can be used for heatingeach object placed on each area, which makes it also possible to use asolder with little lead, and thus the present invention contribute to behighly environmentally friendly.

FURTHER INFORMATION ABOUT TECHNICAL BACKGROUND TO THIS APPLICATION

The disclosure of Japanese Patent Application No. 2003-343076 filed onOct. 1st, 2003 including specification, drawings and claims isincorporated herein by reference in its entirety.

BRIEF DESCRIPTION OF DRAWINGS

These and other objects, advantages and features of the invention willbecome apparent from the following description thereof taken inconjunction with the accompanying drawings that illustrate a specificembodiment of the invention. In the Drawings:

FIG. 1 is a diagram showing the structure of the system of identifyingapparatuses to be recalled in a first embodiment of the presentinvention;

FIG. 2A and 2B are diagrams for respectively explaining an IC tagattached to an air conditioner;

FIG. 3 is a diagram showing the circuit structure of an IC tag readerand writer, and the circuit structure of the IC tag;

FIG. 4 is a block diagram showing the hardware structure of the recalldatabase apparatus;

FIG. 5 is a diagram showing the outline structure of the mounting systemfor mounting electric components on a printed-circuit board;

FIG. 6 is an external view of a mounter;

FIG. 7 is a plan view showing the main structure of the mounter;

FIG. 8A to 8D are diagrams respectively showing an example of anelectric component mounted on a printed-circuit board;

FIG. 9 is a diagram showing an example of a component cassette;

FIG. 10 is a flow chart of processing for identifying products to berecalled performed by a recall database apparatus;

FIG. 11 is a diagram for showing an example of the information itemsrelated to products to be recalled, the information items being storedin the database unit;

FIG. 12 is a diagram showing inside a reflow oven in a second embodimentof the present invention;

FIG. 13 is a diagram showing an example of the information items storedin the IC tag;

FIG. 14 is a function block diagram showing the hardware structure ofthe reflow oven;

FIG. 15 is a block diagram showing another structure of the system ofidentifying appliances to be recalled;

FIG. 16 is an external view of the system of identifying cars to berecalled using an electronic toll collection system (ETC);

FIG. 17 is a flow chart the processing of identifying a printed-circuitboard to be recalled by the recall database apparatus;

FIG. 18 to 21 are diagrams respectively showing an example ofinformation items related to products to be recalled stored in adatabase unit;

FIG. 22 is a diagram of inside a reflow oven; and

FIG. 23 is a function block diagram showing the hardware structure ofthe reflow oven shown in FIG. 22.

BEST MODE FOR CARRYING OUT THE INVENTION First Embodiment

The system of identifying appliances to be recalled in the firstembodiment of the present invention will be explained below withreference to figures.

<System of Identifying Apparatuses to be Recalled>

FIG. 1 is a diagram showing the structure of the system of identifyingapparatuses to be recalled. The system for identifying apparatuses to berecalled 30 is the system for identifying household electric appliancesto be recalled, including household appliances 38 to 46 (an airconditioner 38, an electric oven 40, a television receiving set 42, arefrigerator 44, a washing machine 46) that are set in a house 32, an ICtag reader and writer 34 and a recall database apparatus 37 that isconnected to the IC tag reader and writer 34 placed in each house 32 viathe Internet 36.

An IC tag 48 is attached to household electric appliances 38 to 46 thatare set in the respective houses 32. Each IC tag 48 includes theinformation items related to each product at the time when it ismanufactured (such as a product name, a model, a manufacturing date, aserial number, the names of components in use, the lot number of thecomponents in use, the name of the manufacturing plant where thecomponents in use are manufactured). These information items are readout by the IC tag reader and writer 34 and sends to the recall databaseapparatus 37 via the Internet 36.

FIG. 2A and 2B are diagrams for respectively explaining the IC tag 48attached to the air conditioner 38. As shown in FIG. 2A, all theinformation items at the time of manufacturing the air conditioner 38may be written in an IC tag 48 and then the IC tag 48 may be attached tothe air conditioner 38 itself. Also, as shown in FIG. 2B, the IC tag 48may be attached to the printed-circuit board 52 that is installed insidethe air conditioner 38, and then the information items related to it maybe read out. Note that other household apparatuses 40, 42, 44 and 46 canhave a similar structure.

<IC Tag Reader and Writer>

FIG. 3 is a diagram showing the circuit structure of the IC tag readerand writer 34 and the circuit structure of the IC tag 48.

The IC tag reader and writer 34 includes a modem 64 that is connected tothe alternating-current power supply 62, a control unit 66, an interfaceunit 68 and an antenna 70.

The modem 64 is a circuit for communicating with the IC tag 48 via theantenna 70. It sends power carrier electric radiation to the IC tag 48and receives the information items related to the components that aresent from the IC tag 48. In other words, the modem 64 generates a powercarrier electric radiation of a radio frequency (RF) such as 13.56 MHzwhile receiving a control code outputted from the control unit 66,converts the signal into a power carrier electric radiation, and sendsit via the antenna 70. Also, the modem 64 sends the componentinformation items that should be written in the IC tag 48 via theantenna 70.

The control unit 66 controls the modem 64 to send the power carrierelectric radiation or stop sending the power carrier electric radiation,and the control unit 66 outputs the component information items receivedby the modem 64 to outside via the interface 68.

The IC tag 48 includes an antenna 72, a modem 74, a power generationunit 76 and a logic memory 78. The logic memory 78 stores componentinformation items.

The electric generation unit 76 receives the power carrier electricradiation sent from the IC tag reader and writer via the antenna 72according to an electromagnetic induction type or an electromagneticcoupling type and generates an induced electric power with a highfrequency. The electric power generation unit 76 further not onlycommutes the induced electric power but also smoothes the voltage of thecommuted induced electric power at constant value, stores adirect-current power, and keeps supplying the generated direct-currentpower to the modem 74 and the logic memory 78 while the antenna 72receives the power carrier electric radiation.

The modem 74 modulates the component information items stored in thelogic memory 78 into an electric radiation and outputs the modulatedelectric radiation to outside via the antenna 72. Note that anymodulation method such as an amplitude shift keying (ASK) and afrequency-shift keying (FSK) can be used as long as the modulationmethod matches the demodulation method in the modem 64 of the IC tagreader and writer 34. The modem 74 demodulates the component informationitems sent from the IC tag reader and writer 34 and writes the componentinformation items to the logic memory 78.

<Recall Database Apparatus>

FIG. 4 is a block diagram showing the hardware structure of the recalldatabase apparatus 37. The recall database apparatus 37 is an apparatusfor identifying products to be recalled in the household electricapparatuses 38 to 46 that are set in each house 32, including acalculation control unit 82, a display unit 84, an input unit 86, amemory unit 88, a unit for storing recall product identification program90, a communication interface (I/F) unit 92 and a database unit 94. Therecall database apparatus 37 may be set at the manufacturer of eachproduct or various organizations such as a trade association.

The calculation control unit 82 is, for example, a central processingunit (CPU) or a numeric processor and the like. The calculation controlunit 82 loads, according to an instruction from a user, a programnecessary for the memory unit 88 from the unit for storing recallproduct identification program 90 so as to execute the program andcontrols components 84 to 94 according to the execution result.

The display unit 84 is, for example, a cathode-ray tube (CRT) or aliquid crystal display (LCD), and the input unit 86 is, for example,keyboards or a mouse. These units are used for, for example, enabling anoperator to communicate with the recall database apparatus 37 under thecontrol by the calculation control unit 82.

The communication I/F unit 92 is, for example, a local area network(LAN) adapter or the like. The communication I/F unit 92 is used forcommunication between the recall database apparatus 37 and respective ICtag readers and writers 34 that are set in respective houses 32.

The memory unit 88 is, for example, a random access memory (RAM) thatprovides a work area for the calculation control unit 82. The unit forstoring recall product identification program 90 is, for example, a harddisc storing a program for identifying a product to be recalled by whicha function of the recall database apparatus 37 is realized.

The database unit 94 is, for example, a hard disc storing recall productinformation 96 on the product to be recalled (such as manufacturingperiods and the manufacturer names of the components in use) and thelike.

<Information Items Written in the IC Tag>

The information items such as the information items related to therespective household appliances 38 to 46, the information items relatedto the units included in the respective household appliances 38 to 46 orthe information items related to the components included in therespective units are written in the respective IC tags 48 of theabove-mentioned household appliances 38 to 46 or the respective IC tags48 of the printed-circuit boards 52.

For example, the information items related to each of the householdappliances 38 to 46 include the manufacturer name of the householdappliance, a manufacturing number, a manufacturing period and the like.These information items are, for example, stored in the IC tags 48 thatare set at corresponding household appliances 38 to 46.

Also, the information items related to the units included in each of thehousehold appliances 38 to 46 include the manufacturer name of the unitsuch as a printed-circuit board, a product number, a lot number and theperiod when the unit is set up. Note that, taking an example where thehousehold appliance is the air conditioner 38, a unit except theprinted-circuit board may be a compressor or a piping unit. Note thatthese information items are stored in, for example, the IC tags 48 thatare respectively set at the corresponding household appliances 38 to 46.

Also, taking an example where the unit is the printed-circuit board 52,the information items related to the components included in each of theunits includes the later-listed information items (1) to (9). Theseinformation items are written in, for example, the IC tag 48 that is setat a printed-circuit board 52. Note that, when a unit is manufactured,the manufacturing information of the unit is written in the IC tag 48that is set at a part other than the printed-circuit board 52 in theunit.

(1) items of misregistration information in printing, spreading glue andmounting components and the like

(2) information items related to a manufacturing method executed by aprocess apparatus such as items of temperature information and variousitems of concentration information of nitrogen

(3) items of quality information such as the manufacturer name of acomponent, a lot number, a manufacturing period, a type, a productnumber, a composition, a size, a color and a heat characteristic (suchas a heat resistant temperature and a temperature acceleration)

(4) items of operation information such as the name of manufacturingplant, a mounter name, an operator name and a manufacturing date

(5) items of quality control information such as the operating ratio ofeach mounter, the pick-up rate of each component, the mounting rate ofeach component, various kinds of error rates, component supplyinformation, the information related to the pick-up nozzle in use, theinformation related to the camera in use, the information related to thehead in use, the information related to the cassette in use and tacttime

(6) items of quality information such as control value informationrelated to a material that deteriorates with age: information items suchas the processing time which starts from the time when thelater-explained solder printer 102 prints a cream solder and finishes atthe time when the solder is fixed in the later-explained reflow oven 109or the processing time which starts from the time when glue is spread inthe later-explained glue dispenser 104 and finishes at the time when thespread glue is solidified in the later-explained glue curing oven 108.

(7) information items related to a printed-circuit board such as amaterial, a manufacturing period, the distortion information obtainedfrom CAD data, the information related to locations where components aremounted, the information related to mounting support pins, a heatcharacteristic and the names of the integrated products

(8) information items related to a solder such as the product number,the lot number, the composition and the heat characteristic

(9) information items related to glue such as the product number, thelot number, the composition and the heat characteristic

(10) information items related to a printed-circuit board such as thename, the serial number, the manufacturing date and the lot number; andinformation items related to a product such as the name, the serialnumber, the manufacturing date and the lot number

<Information Item Writing in the IC Tag on a Printed-Circuit Board>

The above-mentioned information items are written in the IC tag 48 inthe process of manufacturing products. Information writing in the IC tag48 at the time of mounting electric components on a printed-circuitboard 52 will be explained below.

FIG. 5 is a diagram showing the outline structure of the mounting systemof mounting electric components on the printed-circuit board 52. Thismounting system is the system for mounting electric components on theprinted-circuit board 52 and writing manufacturing control informationand the like in the IC tag 48 that is set on the printed-circuit board52, and the mounting system includes a solder printer 102, a gluedispenser 104, a component mounter 106, a glue curing oven 108 and areflow oven 109.

The printed-circuit board 52 is sent according to the order indicated byarrows in the figure, and respective apparatuses execute processing ofthe printed-circuit board 52 in order.

The solder printer 102 prints a cream solder on the printed-circuitboard 52 and writes the information items related to a solder such asthe composition and the heat characteristic in the IC tag 48.

The glue dispenser 104 spreads glue for gluing electric components tothe printed-circuit board and writes the information items related tothe characteristics of the glue such as the composition and the heatcharacteristic, and the items of information misregistration inspreading glue in the IC tag 48.

The mounter 106 mounts electric components on the printed-circuit board52 and writes component information items such as the manufacturer nameof the mounted electric components or quality control information andthe like such as the information items related to the camera and thenozzle in use in the IC tag 48. The mounter 106 will be explained indetail later.

The glue curing oven 108 hardens the glue spread by the glue dispenser104 by using heat and writes the information items related to thetemperature at the time of heating in the IC tag 48.

The reflow oven 109 melts the solder spread by the solder printer 102and then solidifies the melted solder so as to fix the electriccomponents and writes the information items related to the temperatureat the time of fixation in the IC tag 48.

The processing explained up to this point enables mounting electriccomponents on the printed-circuit board 52 and writes the qualityinformation, quality control information and the like at the time ofmounting in the IC tag 48 that is set on the printed-circuit board 52.

<Mounter 106>

Next, the mounter 106 included in the mounting system shown in FIG. 5will be explained in detail.

FIG. 6 is an external view of the mounter 106.

The mounter 106 is equipped with two sub stages (a front stage 110 and arear stage 120) that operate simultaneously and independently of oneanother, or in concert, or even alternately. Each of these stages 110and 120 is a perpendicular robotic mounting stage and includes twocomponent supplying units 115 a and 115 b, a line gang pickup head 112,an XY robot 113, a component recognizing camera 116, a tray supplyingunit 117 and an IC tag reader and writer 34. The component supplyingunits 115 a and 115 b are each made up of an array of up to 48 componentfeeders 114 that store component tapes. The line gang pickup head 112has 10 pickup nozzles (hereafter simply “nozzles”) that can pick up amaximum of 10 components from the component feeders 114 and mount themonto the printed-circuit board 20. The XY robot 113 moves the line gangpickup head 112. The component recognizing camera 116 investigates thepicked-up state of the components that have been picked up by the linegang pickup head 112 in two or three dimensions. The tray supplying unit117 supplies tray components. The IC tag reader and writer 34 reads theinformation items stored in the IC tag 48 and writes the informationitems in the IC tag 48. The IC tag 48 is attached to the reel on whichthe component tape is wound up. Each of the stages mounts components onthe printed-circuit board independently from (in parallel with) theother stage.

In this specification, the expression “component tape” refers to a tape(a carrier tape) in which a number of the same type of components havebeen arranged, with such tape being supplied from a reel (a supply reel)or the like around which the tape has been wound. Component tapes areusually used to supply relatively small components called “chipcomponents” to a mounter. However, during the optimization process, a“component tape” refers to data that specifies a group of components ofthe same type that are assumed to have been arranged on a virtual tape).In the process called “component division”, a group of components of thesame type (that would potentially be arranged on a single componenttape) are divided between a plurality of component tapes. Note that“component type” indicates the type of the electric components such as aresistance and a capacitor.

Note that components supplied by a component tape are sometimes called“taped components”.

In more detail, the mounter 106 is a mounting device that includes thefunctions of both a mounting device commonly called a high-speed mounterand a mounting device called a multi-function mounter. A high-speedmounter is a device that is capable of mounting electronic componentsthat are 10 mm or smaller in around 0.1 seconds, while a multi-functionmounter is a device that can mount large electronic components that are10 mm or larger, irregularly shaped components like switches andconnectors, and IC components like Quad Flat Package (QFP) or Ball GridArray (BGA) components.

In short, the mounter 106 is designed so as to be able to mount almostall types of electronic components from 0.6 mm by 0.3 mm chip resistorsto 200 mm connectors, with a production line being formed by arrangingthe required number of mounters 106 in a line.

<Structure of the Mounter>

FIG.7 is a plan view showing the main structure of the mounter 106.

A shuttle conveyor 118 is a moving table (a collection conveyor) onwhich a component taken from the tray supplying unit 117 is placed andwhich is moved to a predetermined position where the line gang pickuphead 112 can pick up components from the shuttle conveyor 118. A nozzlestation 119 is a table on which interchangeable nozzles corresponding tovarious sizes of components are positioned.

The component supplying units 115 a and 115 b included in each stage 110(or 120) are provided on the left and right sides of the componentrecognizing camera 116. The line gang pickup head 112 picks upcomponents from the component supplying unit 115 a or 115 b, passes bythe component recognizing camera 116, and then repeats an operationwhereby the line gang pickup head 112 moves to a mounting location onthe printed-circuit board 20 and mounts one of the picked-up components.The “mounting location” is the address point on the printed-circuitboard at which a component should be mounted. There is a case where thesame-kind component is mounted at a different mounting location. Thetotal number of pieces of components arrayed on the component tapeconcerning the same-kind component (or the total number of mountinglocations) matches the number of components of the kind (the totalnumber of components to be mounted).

In this specification, one iteration of the repeated series of processeswhere the line gang pickup head 112 picks up, transports, and mountscomponents and the group of components handled in such iteration areboth referred to as a “task”. As one example, when the line gang pickuphead 112 has ten nozzles, the maximum number of components that can bemounted by a single task is ten. It should also be noted that a “pickupoperation” refers to all of the operations performed from when the headstarts to pick up components to when the line gang pickup head 112transports the components. In this specification, a pickup operationrefers not only to when ten components are picked up by to the line gangpickup head 112 with a single nozzle stroke (a raising and lowering ofthe line gang pickup head 112), but also when ten components are pickedusing several nozzle strokes.

One or two IC tag readers and writers 34 are set at each sub stage 110(or sub stage 120). The IC tag reader and writer 34 sends electricradiation of a predetermined frequency including a read out command tothe IC tag 48 and receives, from the IC tag 48, the electric radiationof a predetermined frequency including the information items stored inthe IC tag 48. The direction of the electric radiation that is receivedby the two IC tag reader and writer 34 determines the location of the ICtag 48.

Also, the IC tag reader and writer 34 writes, in the IC tag 48 on theprinted-circuit board 52, the operating ratio of the mounter 106, theitems of manufacturing control information such as the component pick-uprate, the information items such as a manufacturer name of the mountedcomponents.

The circuit structure of the IC tag reader and writer 34 is the same asthe one that has already been explained with reference to FIG. 3,detailed explanation on it will not be repeated here.

FIG. 8A to 8D are diagrams respectively showing an example of theelectric components that are mounted on the printed-circuit board 52,the electric components 202 a to 202 d that are shown as FIG. 8A to 8Drespectively are mounted on the printed-circuit board 52. FIG. 9 is adiagram showing an example of the component cassette 114. The componentcassette 114 is supplied to a user in a form of a component tape withthe predetermined number of components wound up by a supply reel 216.The component tape is made by storing these various kinds of electriccomponent chips 202 a to 202 d shown as FIG. 8A to 8D in storage concaveparts 212 a that are formed on the carrier tape 212 in series at acertain interval and attaching a cover tape 214 on the electriccomponent chips. Note that the form of a part where an electriccomponent is stored is not limited to a concave. An IC tag 48 isattached to the supply reel 216, and the following information items arestored in the IC tag 48: the items of manufacturing information such asthe name of the taped components, a head count, the name ofmanufacturer, the name of manufacturing plant, the manufacturing dateand the lot number; and the information items related to the size of thecomponent, the width of the component cassette 114 to which the carriertape 212 is attached, the pitch of the storage concave part 212 a. Theseinformation items are written in the IC tag 48 on the printed-circuitboard 52 at the time of mounting components. Note that an adhesive tapeor a paper tape where components are glued so as to be fixed may be usedinstead of the carrier tape 212 shown in FIG. 9.

<Recall Product Identification Processing>

FIG. 10 is a flow chart of recall product identification processing bythe recall database apparatus 37. It is assumed that there arises a needto exchange a television receiving set 42 with a new product, and thetelevision receiving set 42 becomes a product to be recalled.

The recall database apparatus 37 instructs the IC tag reader and writer34 that is set at each house 32 to read the information items stored inthe IC tag 48 of the television receiving set 42 via the Internet 36(S2). The IC tag reader and writer 34 sends the read information itemsto the recall database apparatus 37. Therefore, the recall databaseapparatus 37 receives the information items (S4). The recall databaseapparatus 37 checks the received information items with the recallproduct information 96 stored in the database unit 94 (S6). In otherwords, the recall database apparatus 37 checks whether the televisionreceiving set 42 corresponding to the received information is theproduct to be recalled.

For example, the recall product information 96 shown in FIG. 11 isregistered in the database unit 94. The recall product information 96indicates products to be recalled are: the television receiving sets 42that were manufactured at the “Nara plant” during the period of “Jan.1st to Dec. 31st, 2000” and include a component manufactured by “A” witha component number of “123” during the period of “Feb. 3rd to Oct. 1st,1999”. In the case where these information items match the informationitems stored in the IC tag 48 of the television receiving sets 42, thetelevision receiving sets 42 are identified as the products to berecalled, and the locations of the television receiving sets 42 to berecalled are identified based on the sending sources of theseinformation items (S8). For example, it is possible to identify thelocations (such as a telephone number and an address) based on networkIDs and the like that are attached to the IC tags 48. This makes itpossible to identify which houses have a television receiving set 42 tobe recalled. Note that the IC tag 48 holds information items other thanthe information items shown in FIG. 11 (such as the manufacturer nameand the product number of the television receiving set 42, the period ofmounting components), and the television receiving sets 42 may beidentified based on these information items.

After that, the recall database apparatus 37 sends, to the IC tags 48 ofthe television receiving sets 42, an instruction for displaying anotification indicating the television receiving set 42 is the productto be recalled on the display screen of the television receiving set 42identified by the network ID via the IC tag reader and writer 34 (S10)and finishes the processing. The television receiving set 42 thatreceived the instruction displays the recall notification on its displayscreen so as to notify the user of the recall.

Note that the display processing (S10) is not performed in the casewhere the product to be recalled is a household appliance that does nothave any display unit such as a refrigerator 44.

As explained up to this point, in this embodiment, the information itemsstored in the IC tag 48 of a product is collected using the IC tagreader and writer 34 that is set at each house so as to judge whetherthe product is the one to be recalled and identify the location of theproduct to be recalled. Therefore, unlike the conventional way, it ispossible to collect products to be recalled efficiently, withoutnotifying users of the recall using a newspaper advertisement or thelike.

Second Embodiment

Next, the reflow oven in the second embodiment of the present inventionwill be explained with reference to figures.

FIG. 12 is a diagram of inside the reflow oven. The reflow oven 109houses the printed-circuit board 52, adds heat to the printed-circuitboard 52 so as to melt the solders of the electric components 132 to 136that are mounted on the printed-circuit board 52 and then cools themdown so as to fix the electric components 132 to 136 on theprinted-circuit board 52.

However, the electric component has a heat characteristic such as a heatresistance temperature and a temperature acceleration. Therefore, in thecase where the temperature inside the reflow oven 109 rises rapidly, acomponent may cause a phreatic explosion. The temperature inside aconventional reflow oven is kept constant because there is a need tokeep the temperature inside the reflow oven high in order to use solderswith little lead. Therefore, the temperature inside the reflow oven mustbe set at a temperature that is suitable for the electric componentwhich has a lowest heat resistance temperature and also the types ofsolders and the like must be selected suitably. For this reason, thereare cases where solders with high lead content must be used.

The reflow oven 109 in the embodiment is different from the conventionalone in that it can change its inside temperature locally.

An IC reader and writer 34 is attached to the reflow oven 109, and theinformation items of the electric components 132 to 136 that are mountedon the printed-circuit board 52 are read out from the IC tag 48 that isset on the printed-circuit board 52.

FIG. 13 is a part of the information items that are stored in the IC tag48, the information items including the names of components, the heatresistant temperatures, the temperature accelerations and the mountinglocations of these components. As an example of the component whosecomponent name is “0603CR”, its heat resistant temperature is 200° C.,its temperature acceleration is 1.5° C./s², the coordinate x, thecoordinate y and the rotation angle θ are 10 mm, 10 mm, and 20°respectively.

FIG. 14 is a functional block diagram showing the hardware structure ofthe reflow oven 109. The reflow oven 109 includes an IC tag reader andwriter 34 that reads out the information items stored in the IC tag 48,a microwave control unit 142 that controls the direction or the strengthof the microwave based on the read information items, and a microwavegeneration unit 144 that generates the microwave and heats each of theelectric components 132 to 136 using a temperature suitable for each ofthe electric components according to the control by the microwavecontrol unit 142.

The microwave control unit 142 identifies the locations of the electriccomponents 132 to 136 based on the information items shown in FIG. 13and performs a control for generating microwave that satisfiesconditions of the heat resistant temperature and the temperatureacceleration.

Note that the technique for locally irradiating the microwave isdisclosed in, for example, the Japanese Laid-Open Patent application No.10-325546 publication, ““news release” [online], Sep. 2nd, 2003,[searched on Sep. 8th, 2003], theInternet<URL:http://www.sharp.co.jp/corporate/news/030902-1. html>.”

As explained up to this point, in this embodiment, it is possible toadjust a temperature inside the reflow oven to a temperature that issuitable for each of the components according to its heatcharacteristic, which eliminates the possibility that an electriccomponent causes a phreatic explosion. Also, as a solder with littlelead can be used for an electric component with a high heat resistanttemperature, there is an effect of being environmentally friendly.

The system for identifying appliances to be recalled and the reflow ovenin the present invention have already been explained based on theembodiment, but the present invention is not limited to this embodiment.

For example, in the first embodiment, as shown in FIG. 15, it ispossible to set a modem 182 inside the house 32, use a wired system inorder to communicate with the household appliances 38 to 46, and use atelephone line in order to connect to the Internet 36. In this case, anIC tag reader and writer (not shown in any figure) is set at each of thehousehold appliances 38 to 46 so that each of the IC tag reader andwriter can read the information items stored in the IC tag 48 in each ofthe household appliances 38 to 46 and send the information items to therecall database apparatus 37 via the modem 182.

Also, household appliances are the products to be recalled in theexplanation of the first embodiment, but the products to be recalled arenot limited to household appliances, that is, they may be otherproducts. For example, the products to be recalled may be cars. FIG. 16is an external view of the system for identifying the cars to berecalled using an electronic toll collection system (ETC). As shown inFIG. 16, an IC tag 48 is attached to a car 174 and, the IC tag 48including various kinds of information items at the time ofmanufacturing the car 174. Also, an IC tag reader and writer 34 is setat an ETC gate 172 so that the information items stored in the IC tag 48of the car 174 can be read out every time a car 174 passes through theETC gate 172. The read information items are sent to the recall databaseapparatus that is not shown in any figure and receives a judgmentwhether it is the product to be recalled. Note that the location wherean IC tag reader and writer is set is not limited to the ETC gate 172,an IC tag reader and writer 34 may be set at a traffic signal, a speeddetector, a number plate reader and the like.

In addition, an object to be recalled may be a printed-circuit board 52that is installed in an apparatus instead of an apparatus itself. FIG.17 is a flow chart of processing for identifying a printed-circuit boardto be recalled performed by a recall database apparatus.

The recall database apparatus 37 sends an instruction, to the IC tagreader and writer 34 set at each house 32 via the Internet 36, ofreading the information items stored in the IC tag 48 of theprinted-circuit boards 52 installed in respective apparatuses 38 to 46(S22). The IC tag reader and writer 34 sends the read information itemsto the recall database apparatus 37. In this way, the recall databaseapparatus 37 receives the information items (S24). The recall databaseapparatus 37 checks the received information items with the recallproduct information 96 stored in the database unit 94 (S26). In otherwords, the recall database apparatus 37 examines whether theprinted-circuit boards 52 corresponding to the received informationitems are the printed-circuit boards to be recalled or not.

For example, the recall product information 96 shown in FIG. 18 isregistered in the database unit 94. In other words, the printed-circuitboard 52 whose product number is “532C” and whose lot number is “1618”is determined as the printed-circuit board to be recalled, and in thecase where these information items match the respectively correspondinginformation items stored in the IC tag 48 of the printed-circuit board52, the location of the printed-circuit board 52 to be recalled isidentified based on the sending source of the information item (S28).Note that some lot numbers of printed-circuit boards are assigned by amanufacturer of the printed-circuit boards 52 and the others areassigned by a manufacturer of a mounter that mounts components on aprinted-circuit boards 52, and it is also possible to identify aprinted-circuit boards 52 to be recalled using these lot numbersassigned in both ways or in either way.

Also, recall product information 96 shown in FIG. 19 may be registeredin the database unit 94. In other words, the printed-circuit board 52 onwhich a component whose product number is “125A” and whose lot number is“38278” is mounted is the printed-circuit board to be recalled. In thecase where these information items match the respectively correspondinginformation items stored in the IC tag 48 of the printed-circuit board52, the printed-circuit board 52 is identified as the printed-circuitboard to be recalled and the location of the printed-circuit board 52 tobe recalled may be identified based on the sending source of theinformation item.

In addition, recall product information 96 shown in FIG. 20 may beregistered in the database unit 94. In other words, the printed-circuitboard 52 on which a component whose product number is “241B” is mountedand satisfies the following conditions at the time of mounting thecomponent is the printed-circuit board 52 to be recalled. Theseconditions at the time of mounting a component is: the head number usedat the time of mounting is “H204”; the pick-up nozzle number in use is“N335”; the tact time is “not more than 0.01 second; the cassette numberin use is “C384”; and the camera in use is “CMR849”. In the case wherethese conditions and the component number match the respectivelycorresponding information stored in the IC tag 48 of the printed-circuitboard 52, the printed-circuit board 52 is identified as theprinted-circuit board to be recalled, and the location of theprinted-circuit board 52 to be recalled may be identified based on thesending source of the information item. In this way, identifying theprinted-circuit board 52 to be recalled based on the conditions at thetime of component mounting makes it possible to easily identify thelocation of the printed-circuit board 52 and collect the printed-circuitboard 52 on which a component is mounted based on a wrong condition evenin the case where it is found that the condition employed at the time ofcomponent mounting was wrong. Note that plural items such as a head, apick-up nozzle, a tact, a cassette, and a camera are specified asmounting conditions of a component to be recalled in the above-mentionedcase, but there is a case where a single item is specified as a mountingcondition of a component to be recalled.

In addition, recall product information 96 shown in FIG. 21 may beregistered in the database unit 94. In other words, a printed-circuitboard 52 to be recalled is identified based on the conditions related tothe material that deteriorates with age. For example, as conditionsrelated to the material that deteriorates with age, two types ofconditions that are conditions concerning a solder and conditionsconcerning glue are registered in the recall product information 96.Conditions concerning a solder that are shown are: the product number ofa cream solder printed on the printed-circuit board 52 is “HA387”; thelot number is “692AB”; and the processing time which starts from thetime when the solder printer 102 prints a cream solder and finishes atthe time when the cream solder is fixed in the reflow oven 109 is “notless than 30 minutes”. Conditions concerning glue that are shown are:the product number of glue spread on the printed-circuit board 52 is“V187”; the lot number is “3547B”; and the processing time which startsfrom the time when the glue dispenser 104 spreads glue and finishes atthe time when the spread glue is solidified in the glue curing oven 108is “not less than 25 minutes”. In the case where these two types ofconditions match the information items stored in the IC tag 48 of theprinted-circuit board 52, the printed-circuit board 52 is identified asthe printed-circuit board to be recalled, and the location of theprinted-circuit board 52 to be recalled may be identified based on thesending source of the information item. In this way, as to a materialthat deteriorates with age, its quality may deteriorate in the casewhere the processing time exceeds the allowed processing time. Thismakes it possible to easily identify the location of the printed-circuitboard 52 and collect the printed-circuit board 52 including a materialthat may have a quality problem.

Further, in the first embodiment, it is possible to give the productsthat have already been identified as the products to be recalled afunction for downloading a firmware from the recall database apparatus37 and updating the firmware automatically.

Note that the product may write the information item indicating that thefirmware has already been updated in the IC tag 48 of the updatedproduct after the update. The recall database apparatus 37 may give aninstruction of writing the information item or the appliance with the ICtag 48 may write the information item. Also, the recall database 37 mayreceive the information item indicating whether the firmware hassuccessfully updated or not via the communication network after theupdate of the firmware.

Note that a date or time for update may be previously set in the recalldatabase apparatus 37 so that the firmware can be automatically updatedwhen it becomes the predetermined date or time. Also, after whether theappliance with an IC tag 48 is operated or not is checked, the firmwaremay be automatically updated in the case where the appliance is notoperated. Further, appliances such as household appliances 38 to 46, toeach of which an IC tag 48 is attached may set a date or time for updateand update the firmware when it becomes the predetermined date or time.In addition, it is also possible to cause the appliances to update theirfirmware automatically at date or time that has already been set by auser of the household appliances 38 to 46 respectively.

Also, the reflow oven in the second embodiment adjusts the temperatureof its inside to a temperature suitable for each component by generatingmicrowave, but it is also possible to adjust the temperature of itsinside by blowing warm air suitable for each component. FIG. 22 is adiagram of inside the reflow oven like this. The reflow oven 209 haswarm air nozzles 152, 154 and 156 for blowing warm air on the electriccomponents 132 to 136 respectively. Note that the number of the warm airnozzles 152, 154 and 156 is not limited to 3.

FIG. 23 is a functional block diagram showing the hardware structure ofthe reflow oven 209. The reflow oven 209 includes: an IC tag reader andwriter 34 that reads the information items stored in the IC tag 48; awarm air nozzle control unit 162 that controls the locations of the warmair nozzles 152, 154 and 156, the temperatures of the warm air thatcomes from the warm air nozzles 152, 154 and 156, the temperatureaccelerations and the like based on the read information items; and awarm air generation unit 164 that blows warm air via the warm airnozzles 152, 154 and 156 according to the control by the warm air nozzle162.

INDUSTRIAL APPLICABILITY

The present invention is available as a method for identifyingapparatuses to be recalled, a method for heating based on theinformation items stored in an IC tag, a method for recalling householdappliances or cars, a method for heating electric components in a reflowoven and the like.

1. A method for identifying an apparatus to be recalled, comprising:collecting information items stored in an integrated circuit (IC) tagattached to an apparatus via a communication network; checking thecollected information items with respectively corresponding informationitems related to the apparatus to be recalled; and identifying theapparatus to be recalled, among apparatuses, to each of which an IC tagis attached, based on a checking result and one of the information itemswhich indicates a sending source stored in the IC tag.
 2. The method foridentifying an apparatus to be recalled according to claim 1, whereinthe IC tag holds one or more information items related to the apparatussuch as a manufacturer name, a product number and a manufacturingperiod, and in the checking, (i) one or more information items relatedto the apparatus such as the manufacturer name, the product number andthe manufacturing period that are collected in the colleting are checkedwith (ii) one or more information items related to the apparatus to berecalled, (i) and (ii) being in a one-to-one correspondence.
 3. Themethod for identifying an apparatus to be recalled according to claim 1,wherein the IC tag is attached to a printed-circuit board thatconstitutes the apparatus, and in the identifying, the printed-circuitboard to be recalled, among printed-circuit boards, to each of which anIC tag is attached, is identified based on a checking result and one ofthe information items which indicates a sending source stored in the ICtag.
 4. The method for identifying an apparatus to be recalled accordingto claim 3, wherein the IC tag holds one or more information itemsrelated to a component mounted on the printed-circuit board thatconstitutes the apparatus such as a component manufacturer name, acomponent number and a component manufacturing period, and in thechecking, (i) one or more information items related to the componentmounted on the printed-circuit board that constitutes the apparatus suchas the component manufacturer name, the component number and thecomponent mounting period that are collected in the colleting arechecked with (ii) one or more information items related to the componentmounted on the printed-circuit board to be recalled, (i) and (ii) beingin a one-to-one correspondence.
 5. The method for identifying anapparatus to be recalled according to claim 3, further comprisingwherein the IC tag stores a component number and a mounting condition ofthe component that is mounted on the printed-circuit board thatconstitutes the apparatus, in the checking, (i) the component number andthe mounting condition of the component that is mounted on theprinted-circuit board that constitutes the apparatus collected in thecollecting are checked with (ii) the component number and the mountingcondition of the component mounted on the printed-circuit board to berecalled, (i) and (ii) being in a one-to-one correspondence.
 6. Themethod for identifying an apparatus to be recalled according to claim 3,further comprising wherein the IC tag stores information items relatedto a material that deteriorates with age used for the printed-circuitboard that constitutes the apparatus, in the checking, (i) theinformation items related to the material that deteriorates with ageused for the printed-circuit board that constitutes the apparatuscollected in the colleting are checked with (ii) the information itemsrelated to the material that deteriorates with age used for theprinted-circuit board to be recalled, (i) and (ii) being in a one-to-onecorrespondence.
 7. The method for identifying an apparatus to berecalled according to claim 1, further comprising causing the displayunit to display a notification that the apparatus is the apparatus to berecalled in the case where the apparatus identified as the apparatus tobe recalled in the identifying has a display unit.
 8. The method foridentifying an apparatus to be recalled according to claim 1, furthercomprising causing the apparatus to update a firmware of the apparatusidentified as the apparatus to be recalled in the identifying.
 9. Themethod for identifying an apparatus to be recalled according to claim 8,further comprising writing, after the update, that the firmware hasalready been updated on the IC tag attached to the apparatus whosefirmware has already been updated.
 10. The method for identifying anapparatus to be recalled according to claim 8, further comprisingcollecting an information item indicating whether the update of thefirmware has successfully finished or not via a communication networkafter the update.
 11. The method for identifying an apparatus to berecalled according to claim 8, wherein, in the updating, causing theapparatus to update the firmware of the apparatus identified as theapparatus to be recalled in the identifying at a predetermined date ortime.
 12. The method for identifying an apparatus to be recalledaccording to claim 8, further comprising examining an operating statusof the apparatus to which the IC tag is attached, wherein, in theupdating, causing the apparatus to update the firmware of the apparatusidentified as the apparatus to be recalled in the identifying when theapparatus is not operated.
 13. The method for identifying an apparatusto be recalled according to claim 1, wherein the collecting includes:reading information items stored in the IC tag attached to an apparatusin a non-contact manner; and collecting the read information items via acommunication network.
 14. A method for writing information items in anIC tag placed on a printed-circuit board, comprising writing one or moreinformation items among a component manufacturer name, a componentnumber and a component mounting period on the IC tag mounted on theprinted-circuit board at the time when the component is mounted on theprinted-circuit board.
 15. A program causing a computer to execute:collecting information items stored in an IC tag attached to anapparatus via a communication network; checking the collectedinformation items with respectively corresponding information itemsrelated to an apparatus to be recalled; and identifying the apparatus tobe recalled, among apparatuses, to each of which an IC tag is attached,based on a checking result and one of the information items whichindicates a sending source stored in the IC tag.
 16. A device foridentifying an apparatus to be recalled, comprising: a collecting unitoperable to collect information items stored in an IC tag attached tothe apparatus via a communication network; a memory unit operable tomemorize information items related to the apparatus to be recalled; achecking unit operable to check information items collected in thecollecting with respectively corresponding information items related tothe apparatus to be recalled; and an identifying unit operable toidentify the apparatus to be recalled, among apparatuses, to each ofwhich an IC tag is attached, based on a checking result and aninformation item which indicates a sending source stored in the IC tag.17. The device for identifying an apparatus to be recalled according toclaim 16, further comprising a display instructing unit operable toinstruct the display unit to display a notification that the apparatusis the apparatus to be recalled in the case where the apparatusidentified as the apparatus to be recalled in the identifying has adisplay unit.
 18. A system for identifying an apparatus to be recalledcomprising: an apparatus to which an IC tag is attached; a reading unitthat reads information items stored in the IC tag; and a device thatidentifies the apparatus to be recalled connected to the reading unitvia a communication network, wherein the device that identifies theapparatus to be recalled includes: a collecting unit that collectsinformation items, which are read by the reading unit, stored in the ICtag attached to the apparatus via a communication network; a memory unitthat memorizes information items related to the apparatus to berecalled; a checking unit that checks (i) information items collected inthe collecting with (ii) respectively corresponding information itemsrelated to the apparatus to be recalled; and an identifying unit thatidentifies the apparatus to be recalled, among apparatuses, to each ofwhich an IC tag is attached, based on a checking result and one ofinformation items which indicates a sending source stored in the IC tag.19. The system for identifying an apparatus to be recalled according toclaim 18, wherein the device that identifies the apparatus to berecalled further includes a display instructing unit that instructs thedisplay unit to display a notification that the apparatus is theapparatus to be recalled in the case where the apparatus identified asthe apparatus to be recalled by the identifying unit has a display unit.20. The system for identifying an apparatus to be recalled, according toclaim 18, wherein the reading unit is installed in the apparatus. 21.The system for identifying an apparatus to be recalled according toclaim 18, wherein the apparatus is a household appliance, and thereading unit is installed in a house.
 22. The system for identifying anapparatus to be recalled, according to claim 18, wherein the apparatusis a car, and the reading unit is installed in a road area.